TEMSCON 2018
2018 International Conference of the IEEE Technology and Engineering Management Society

Orrington Hilton

Evanston, IL USA

2 blocks from Northwestern University campus

June 28-July 1, 2018

Engineering Management in an era of disruption

We invite contributions from researchers, educators, managers and students. Contributions may be conceptual, theoretical, or empirical. They should document research activities, case studies or best practices, shedding light on the theory or practice of engineering, technology, or innovation management, and addressing the strategic objectives of technological change.

There will be an opportunity to publish in IEEE Engineering Management Review as well as a Special Issue of our journal IEEE Transactions on Engineering Management for selected papers submitted to the conference.

In addition to these core topics, we have special sessions on management during these challenging times as seen by IEEE societies. For topic details, see us at www.temscon.org. We will also be hosting:

Education programs in Technology and Engineering Management
Speakers and panels on disruptive technologies and business and managerial practices
Tours of Chicago area technology and innovation centers
Editor’s Panel – publication outlets in Technology and Engineering Management

Important Dates:    

Key Dates Leading up to the Event
03/01/2018 Paper submissions due (to EDAS)
02/01/2018 Early bird registration opens; hotel block opens
04/01/2018 Notification of acceptance
04/15/2018 Revisions due (for papers requiring revisions)
05/01/2018 Author registration due
05/01/2018 Regular registration
05/01/2018 Final papers due
06/01/2017 Announcement of top papers chosen to be published in IEEE Transactions or IEEE EMR
05/01/2018 Deadline for Autor Registration
06/10/2018 Deadline for registration refund with 15% fee (conference cancellation policy)
05/15/2018 Papers to EDAS for conference proceedings
06/07/2018 Hotel block deadline (i.e. after 6/7, block rooms may be available but are no longer guaranteed)
Key Dates The Event
6/28-6/30 Conference
6/29/2018 Industry Forum (one day)
6/27 & 7/1 Tours (optional)
07/01/2018 Internal AdCom meetings
07/30/2018 Papers submitted to IEEE for XPLORE release

 

Please note: All papers should follow the IEEE manuscript template for conference proceedings, found at https://www.ieee.org/conferences_events/conferences/publishing/templates.html

Please use the US letter format, only. The maximum font size allowed is 10. Papers no longer than 6 pages are highly encouraged. 7-page and 8-page papers are allowed, with a charge of $100/page greater than 6. Papers longer than 8 pages will be rejected without review.

 

Author funding:
Four students representing the top student papers will be chosen and each will be awarded 2 nights of hotel accommodations free of charge. All student papers will be considered. Awardees will be notified via email by the committee.

 

For more details contact: Peggy (peggy.matson@northwestern.edu) and Jason (jason.k.hui@ieee.org)