Sixty-Six Technical Paper Authors from Twenty-Four Countries Present at TEMSCON 2018
We are coming off the heels of a successful TEMSCON conference in the Chicago area! More specifically, the IEEE TEMS hosted TEMSCON 2018 June 28th through June 30th in Evanston, Illinois — bordering the city of Chicago, and in the backyard of Northwestern University.
The theme of the conference was engineering management in an era of disruption. Almost all of the sixty-six papers were a display of teamwork — academic professors, university students, industry professionals. Some of the most popular sessions included innovation & entrepreneurship, strategy, and managing complex systems & products.
Each paper presented at TEMSCON is submitted to a peer-review prior to acceptance by the program committee. And each paper that is accepted and presented gets published in Xplore. All conference attendees walk away with free access to all conference papers.
Not only does TEMSCON present an opportunity for thought leaders to share their ideas through paper sessions, conference networking breaks offer an opportunity for authors and attendees to interact more informally. The conference also included several special presentations on industry-academia collaboration, as well as presentations by some of Northwestern’s finest academic minds. And all were treated to numerous keynote speakers from across the U.S., representing Fortune 500 corporations such as Intel, as well as start-ups, and everything in between.
Save the date for next year, the 3rd annual TEMSCON: June 12-14th, 2019 in Atlanta Georgia!